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1

A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish

Mhd Noor, Ervina Efzan, R., Baaljinder, J., Emerson

Journal:

Soldering & Surface Mount Technology

Year:

2018

Language:

english

File:

PDF, 567 KB

english, 2018

2

A review: lead free solder and its wettability properties

Mhd Noor, Ervina Efzan, Mhd Nasir, Nur Faziera, Idris, Siti Rabiatul Aisya

Journal:

Soldering & Surface Mount Technology

Year:

2016

Language:

english

File:

PDF, 271 KB

english, 2016

3

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Efzan Mhd Noor, Ervina, Singh, Amares

Journal:

Soldering & Surface Mount Technology

Year:

2014

Language:

english

File:

PDF, 419 KB

english, 2014

4

A review: influence of nano particles reinforced on solder alloy

Efzan Mhd Noor, Ervina, Singh, Amares, Tze Chuan, Yap

Journal:

Soldering & Surface Mount Technology

Year:

2013

Language:

english

File:

PDF, 686 KB

english, 2013

5

Review on recent Photovoltaic/Thermal (PV/T) technology advances and applications

Sultan, Sakhr M., Ervina Efzan, M.N.

Journal:

Year:

2018

File:

PDF, 5.34 MB

2018

6

Review on recent Photovoltaic/Thermal (PV/T) technology advances and applications

Sultan, Sakhr M., Ervina Efzan, M.N.

Journal:

Year:

2018

Language:

english

File:

PDF, 5.34 MB

english, 2018

7

Review on Pipelines in Offshore Platform Processing System

Ervina Efzan, Mohd Noor, Kesahvanveraragu, S.

Journal:

Applied Mechanics and Materials

Year:

2014

Language:

english

File:

PDF, 316 KB

english, 2014

8

A review of underground building towards thermal energy efficiency and sustainable development

Alkaff, Saqaff A., Sim, S.C., Ervina Efzan, M.N.

Journal:

Renewable and Sustainable Energy Reviews

Year:

2016

Language:

english

File:

PDF, 6.34 MB

english, 2016

9

Low temperature In–Bi–Zn solder alloy on copper substrate

Noor, Ervina Efzan Mhd, Zuhailawati, H., Radzali, Othman

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 1.09 MB

english, 2016

10

A Review on Effect of Nanoreinforcement on Mechanical Properties of Polymer Nanocomposites

Ervina Efzan, M.N., Siti Syazwani, N.

Journal:

Solid State Phenomena

Year:

2018

Language:

english

File:

PDF, 843 KB

english, 2018

11

A new approach for photovoltaic module cooling technique evaluation and comparison using the temperature dependent photovoltaic power ratio

Sultan, Sakhr M., Tso, C.P., Efzan, M.N. Ervina

Journal:

Sustainable Energy Technologies and Assessments

Year:

2020

File:

PDF, 1.09 MB

2020

12

A new method for reducing the performance evaluation cost of the photovoltaic module cooling techniques using the photovoltaic efficiency difference factor

Sultan, Sakhr M., Tso, C.P., Ervina Efzan, M.N.

Journal:

Case Studies in Thermal Engineering

Year:

2020

File:

PDF, 1.11 MB

2020

13

Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate

Ervina Efzan Mhd Noor, Nurulakmal Mohd Sharif, Cheong Kuan Yew, Tadashi Ariga, Ahmad Badri Ismail, Zuhailawati Hussain

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 746 KB

english, 2010

14

Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

Ervina, Efzan M.N., Tan, S.Y.

Journal:

Applied Mechanics and Materials

Year:

2013

Language:

english

File:

PDF, 2.71 MB

english, 2013

15

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Characteristic of low temperature of Bi-In-Sn solder alloy

Ervina Efzan Mhd Noor,, Ahmad Badri Ismail,, Nurulakmal Mohd Sharif,, Ariga, Tadashi, Hussain, Zuhailawati

Year:

2008

Language:

english

File:

PDF, 956 KB

english, 2008

16

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Characterization of mechanical testing on lead free solder on electronic application

Ervina, Efzan M.N., Singh, Amares

Year:

2012

Language:

english

File:

PDF, 4.22 MB

english, 2012

17

Review: Effect of Alloying Element on Al-Si Alloys

Ervina Efzan, Mohd Noor, Kong, H.J., Kok, C.K.

Journal:

Advanced Materials Research

Year:

2013

Language:

english

File:

PDF, 264 KB

english, 2013

18

Characterizations of Physical Properties of Sn-Bi Solder Alloy

Amares, S., Ervina Efzan, Mohd Noor, Yap, T.C.

Journal:

Advanced Materials Research

Year:

2013

Language:

english

File:

PDF, 397 KB

english, 2013

19

Fabrication Method of Aluminum Matrix Composite (AMCs): A Review

Ervina Efzan, Mohd Noor, Siti Syazwani, N., Al Bakri Abdullah, Mohd Mustafa

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 341 KB

english, 2016

20

Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate

Ervina Efzan, Mohd Noor, Al Bakri Abdullah, Mohd Mustafa

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 1.25 MB

english, 2016

21

Mechanical and Physical Properties of In-Zn-Ga Lead-Free Solder Alloy for Low Energy Consumption

Efzan, M.N. Ervina, Faziera, M.N. Nur, Abdullah, Mohd Mustafa Al Bakri

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2016

Language:

english

File:

PDF, 870 KB

english, 2016

22

Microstructure and Mechanical Properties of Fly Ash Particulate Reinforced in LM6 for Energy Enhancement in Automotive Applications

Efzan, M.N. Ervina, Syazwani, N. Siti, Abdullah, Mohd Mustafa Al Bakri

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2016

Language:

english

File:

PDF, 1.41 MB

english, 2016

23

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh, Amares, Mhd.Noor, Ervina Efzan, Guojian, C., Muhammad, Y.

Journal:

MATEC Web of Conferences

Year:

2015

Language:

english

File:

PDF, 2.30 MB

english, 2015

24

Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate

Efzan, M. N. Ervina, Ng, W.L., Abdullah, Mohd Mustafa Al Bakri

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2016

Language:

english

File:

PDF, 1.20 MB

english, 2016

25

Properties of Aluminum Matrix Composite (AMCs) for Electronic Packaging

Ervina Efzan, Mohd Noor, Siti Syazwani, Nordin, Emerson, J.

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 398 KB

english, 2016

26

Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy

Ervina Efzan, Mohd Noor, Nur Faziera, Mhd Nasir

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 300 KB

english, 2016

27

Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate

Mhd Noor, Ervina Efzan, Ogundipe, Ayodeji Samson, Goosey, Martin

Journal:

Soldering & Surface Mount Technology

Year:

2017

Language:

english

File:

PDF, 1.50 MB

english, 2017

28

AIP Conference Proceedings [Author(s) ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY V: International Conference on Advanced Material Engineering and Technology 2016 - Kaohsiung City, Taiwan (8–9 December 2016)] - The influences of dopants on lead free solder alloy

N., Ervina Efzan M., N., Nur Faziera M., Abdullah, Mohd Mustafa Al Bakri

Year:

2017

Language:

english

File:

PDF, 185 KB

english, 2017

29

Influence of Nano-3%Al 2 O 3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy

Amares, S, Ervina Efzan, M N, Durairaj, Rajkumar, Niakan, Aliasghar

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2017

Language:

english

File:

PDF, 515 KB

english, 2017

30

AIP Conference Proceedings [Author(s) GREEN DESIGN AND MANUFACTURE: ADVANCED AND EMERGING APPLICATIONS: Proceedings of the 4th International Conference on Green Design and Manufacture 2018 - Ho Chi Minh, Vietnam (29–30 April 2018)] - A thermal performance study for different glazed water based photovoltaic thermal collectors

Sultan, Sakhr M., Tso, C. P., N., Ervina Efzan M.

Year:

2018

Language:

english

File:

PDF, 905 KB

english, 2018

31

AIP Conference Proceedings [Author(s) GREEN DESIGN AND MANUFACTURE: ADVANCED AND EMERGING APPLICATIONS: Proceedings of the 4th International Conference on Green Design and Manufacture 2018 - Ho Chi Minh, Vietnam (29–30 April 2018)] - The effect of mass flow rate and solar radiation on the photovoltaic efficiency of a glazed water based PVT

Sultan, Sakhr M., Tso, C. P., Efzan, Ervina

Year:

2018

Language:

english

File:

PDF, 793 KB

english, 2018

32

Modelling the elastic behavior of an industrial printed circuit board under bending and shear

Loon, Kuan Teng, Kok, Chee Kuang, Noor, Ervina Efzan Mohd, Ooi, Chin Chin

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.49 MB

english, 2018

33

Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte

Ervina Efzan, M.N., Kamaneeya, R.

Journal:

Solid State Phenomena

Year:

2018

Language:

english

File:

PDF, 260 KB

english, 2018

34

Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte

Ervina Efzan, M.N., Kamaneeya, R.

Journal:

Solid State Phenomena

Year:

2018

File:

PDF, 260 KB

2018

35

Dielectrophoresis of Amyloid-Beta Proteins as a Microfluidic Template for Alzheimer’s Research

Al-Ahdal, Salman Ali, Ahmad Kayani, Aminuddin Bin, Md Ali, Mohd Anuar, Chan, Jun Yuan, Ali, Talal, Adnan, Norah, Buyong, Muhamad Ramdzan, Mhd Noor, Ervina Efzan, Majlis, Burhanuddin Yeop, Sriram, Shar

Journal:

International Journal of Molecular Sciences

Year:

2019

Language:

english

File:

PDF, 3.64 MB

english, 2019

36

A new production cost effectiveness factor for assessing photovoltaic module cooling techniques

Sultan, Sakhr M., Tso, Chih Ping, Ervina, Efzan M.N.

Journal:

International Journal of Energy Research

Year:

2019

Language:

english

File:

PDF, 1.04 MB

english, 2019